TSMC has been at the forefront of semiconductor technology advancement, delivering industry-leading solutions with a predictable cadence to achieve greater energy-efficient computing to unleash future innovations.
TSMC A14 process technology, debuted at its 2025 North America Technology Symposium, is its next cutting-edge logic process technology, leveraging TSMC NanoFlex™ Pro, a new compact standard cell architecture.
TSMC NanoFlex™ Pro, evolving from TSMC’s profound experience in design-technology co-optimization (DTCO) for nanosheet transistor, enables greater performance, power efficiency and design flexibility, achieving full-node PPA scaling through dimensional shrink.
A14 is the industry’s most advanced logic technology and is our second-generation nanosheet technology. Compared to TSMC 2nm (N2) technology, A14 offers a 10-15% speed improvement at the same power, or a 25-30% power reduction at the same speed. It will drive AI transformation forward, enabling comprehensive AI solutions from Edge to Cloud.
Watch the video and explore new possibilities with NanoFlex™ Pro by TSMC.
